Como os poderes estruturais chinês e estadunidense no setor de semicondutores influenciaram a disputa tecnológica durante o governo Biden?

Abstract

This study analyzes how the structural powers of China and the United States influenced the technological dispute between the two superpowers during the Biden administration. Grounded in Susan Strange's theoretical framework on structural power, this research investigates how the superpowers leverage this capacity in their strategies within the technological competition. The methodology combined a literature review with the analysis of legislative documents, industry reports, and data concerning the global semiconductor production chain. Both countries sought to implement strategies, policies, and instruments to foster and expand their own structural power through the domestic development of integrated circuit production capacities, aiming to reshape the global microchip production chain to their advantage. The findings indicate that, although the Sino-American technological dispute in the integrated circuit sector favors the decoupling of the global chip production chain, it continues to depend on the participation of both China and the US.